From Lab to Launch: Fostering Entrepreneurship at IECON 2025
By Bruno Iafelice, PhD – TVLP Institute, USA
At the IECON 2025 conference in Madrid, the “From Idea to Venture” workshop equipped scientists, engineers, and industry professionals with practical tools and new venture creation insights to transform innovation into real-world impact. Held on 14 October 2025, the …
Reskilling Through Entrepreneurship: Some IES initiatives for Future-Ready Talents
By Bruno Iafelice and Sandeep Patil
Organizations across industries, academia, and research are grappling with rapid technological shifts, disruptive global events, and a volatile labor market. From the aftershocks of the COVID-19 pandemic to the acceleration of automation and the emergence of generative artificial intelligence (GenAI), …
From Idea to Venture: Lessons from Rafael González del Castillo Sancho for Engineering Education and Industry
By Bruno Iafelice, PhD – TVLP Institute, USA
At IECON 2025, the annual conference of the IEEE Industrial Electronics Society held in Madrid, entrepreneurship was brought into the discussion through the workshop “From Idea to Venture.” Organized by the IES Industry and Membership Committees, the session explored …
From Lab to Market: Why the Hard Tech Venture Summit Matters for Electronics Engineers
As hardware makes its comeback, a new opportunity emerges for researchers and entrepreneurs to turn deep-tech innovations into funded ventures.
By Bruno Iafelice, PhD – Summit Chair IEEE Entrepreneurship and Industry Liaison IES TC Education – CEO TVLP Institute, USA
For years, the startup world seemed to …
Industry, Startups, and Investors at the Heart of ETFA 2025: What We Did and Why
By Bruno Iafelice (TVLP Institute, USA) and Gil Goncalves (University of Porto, Portugal)
Industry Forum at ETFA 2025, Porto, Plenary Session. (L-R): Gil Gonçalves (Moderator – standing), Marlos Silva (Sonae), Teresa Conceilção (NVIDIA), João Pereira (Portugal Ventures), Michael Olshimke (Scalefree), Cristina Cristalli (U-Sense).
When Bruno Iafelice and Gil Goncalves met …
IES Growing Steadily in 2025 with Increasing Membership Promotion and Global Engagement
By Ya-Jun Pan – Vice President for Membership Activities
The IEEE Industrial Electronics Society (IES) is growing steadily in 2025. As of 18 October, IES members are reaching the milestone of 13,000 in the history. Note that there are 50% increase of the students’ membership grades …
Want to launch a hard-tech venture? Do it now.
By Bruno Iafelice, PhD, TVLP Institute
If you are a scientist or an engineer in academia or industry and believe you can combine several hard tech disciplines, such as advanced materials, robotics, biotechnology, and clean energy, to develop an innovation, continue reading this article.
The ventures deeply …
Highlights from the First IEEE IES SYP Congress 2024
By Tripura Pidikiti and Ala Chalghaf
From left to right, Tripura Pidikiti, Ravindra Kommineni, Ala Chalghaf, Madhav Negi, Antonio Luque, Bhuvaneswari Gurumoorthy and Milos Manic at the IES SYP Congress 2024 in Hyderabad
IEEE IES SYP Congress 2024: Event Summary
The inaugural IEEE Industrial Electronics Society Students and Young …
Static and Dynamic Wireless Power Transfer with Wide-Range Output and High Efficiency
Friday 24 November 2023 at 8:00 PM CST (1:00 PM CET, 7:00 AM EST)
By Zhicong Huang (Shien-Ming Wu School of Intelligent Engineering at South China University of Technology, China)
Register now using the link below:
https://attendee.gotowebinar.com/register/3765967397218157911
Abstract:
Wireless power transfer (WPT) via magnetic coupling can have both the transmitter …
2024 ICPS – 7th IEEE International Conference on Industrial Cyber Physical Systems
ICPS 2024 will be held 12-15 May 2024 in St. Louis, USA.
The conference will provide an international platform for cutting edge research and professional interactions for the development of Industrial Cyber-Physical Systems. Industry experts, researchers and academics will share ideas and experiences surrounding frontier technologies, …