By Antonio Luque – IES Regional Summits coordinator

The inaugural IES Regional Summit was held in Ningbo, China, on 29 June 2026, launching a new event series designed to bring together researchers, industry professionals, recent graduates, entrepreneurs, and IES volunteers. The Regional Summits aim to foster connections, create new opportunities for collaboration, and increase the visibility of the IEEE Industrial Electronics Society (IES) within the industrial electronics community.

The IES Summit China 2026 took place at the Yongjiang Laboratory (Y-LAB) in Ningbo, which generously provided its facilities for the event. The Summit was organized with the support of Ningbo Institute of Intelligent Equipment Technology Co., Ltd. and Harbin Institute of Technology. More than 90 researchers, industry practitioners, and students from Ningbo and across China attended the event.

The program opened with a presentation on the IEEE Industrial Electronics Society, delivered by IES President Juan José Rodríguez-Andina, followed by an overview of IEEE and its 2025–2030 strategic goals, presented by Antonio Luque.

The remainder of the morning focused on IES membership opportunities and initiatives. IES Vice President for Membership Activities Ya-Jun Pan presented the Society’s membership programs, while Jing Zhou, IES WIE Coordinator, introduced initiatives through which members and prospective members can become involved in IES activities.

The morning continued with informative sessions on professional recognition and career development. Mariusz Malinowski provided guidance on the IEEE Fellow grade and the application process, while Yang Shi presented the IES Awards program, offering practical advice on preparing successful award applications.

Building local connections through Hubs & Nodes

The afternoon featured a series of practical sessions, beginning with a presentation on the IES Hubs & Nodes initiative by President Rodríguez-Andina. Participants learned how the Hubs & Nodes framework can support the development of local activities and strengthen collaboration with industry.

The session generated strong interest among attendees. Existing IES volunteers were encouraged to initiate the development of new hubs and nodes across China, while non-members gained a better understanding of the benefits of joining IES and participating in local professional activities.

Another highly appreciated session focused on IES products and publications. Leopoldo G. Franquelo, founding Editor-in-Chief of the IEEE Open Journal of the Industrial Electronics Society (OJIES), shared valuable insights with the research community on preparing papers with strong potential for visibility and citations, as well as on navigating the journal submission, peer-review, and editorial processes.

An open dialogue with IES leadership

A key feature of the Summit was the opportunity for attendees to submit questions and suggestions directly to IES leaders and volunteers. These contributions were collected and addressed during an interactive panel discussion, providing IES leadership with first-hand insight into the needs, expectations, and recommendations of grassroots members and volunteers.

The panel was moderated by Mousmi Ajay Chaurasia and generated a lively and constructive discussion. Suggestions included increasing opportunities for members to volunteer at conferences, encouraging joint Chapters with other IEEE Societies, expanding financial support for students, introducing certificates recognizing contributions to IES activities, developing new Women in Engineering (WIE) initiatives, and organizing additional student competitions.

The recommendations raised during the discussion will be brought to the appropriate IES governing bodies for further consideration.

Connecting IES with local industry

Following the formal program, participants took part in a series of technical and industrial visits. The first visit was to Yongjiang Laboratory, where participants learned more about its research activities and technology-transfer initiatives.

The group then visited several companies in the Ningbo area, gaining insight into industrial applications of electronics in fields including pick-and-place machinery and diamond manufacturing. The day concluded with a networking dinner aboard a cruise, providing participants with an informal setting to continue discussions and develop new connections.

Strengthening the IES community

The IES Summit China 2026 provided a valuable platform for researchers, students, industry professionals, and volunteers to connect with one another and engage directly with IES leadership. Beyond sharing information about IES programs and opportunities, the event demonstrated how a professional society can help create new collaborations and strengthen connections between academia, industry, and the broader industrial electronics community.

Following the successful launch in Ningbo, the next IES Regional Summit will focus on Brazil and neighboring countries and is scheduled to take place in Rio de Janeiro on 14 August 2026.