Submit your work to this special section, organized by Prof. Mo-Yuen Chow, Prof. Chengbin Ma, Prof. Federico Baronti, Prof. Alfonso Damiano, Dr. Bharat Balagopal. Click read more for CFP and submission website... READ MORE
IEEE IES is now accepting paper submissions for its new gold fully open access IEEE Open Journal of the Industrial Electronics Society, spanning the full scope of IEEE Industrial Electronics Society’s fields of interest. Click read more for CFP and submission website... READ MORE
Minfan Fu - ShanghaiTech University (China) Rui Ma - Northwestern Polytechnical University (China) Marek Jasinski - Warsaw University of Technology (Poland) Wangli He - East China University of Science and Technology (China) Sertac Bayhan - Hamad Bin Khalifa University (Qatar) Pradyumn Chaturvedi - Visvesvaraya National Institute of Technology (India)
It is our great pleasure to announce that the following 6 IES members have been made IEEE Fellows (effective 1 Jan 2020) through Industrial Electronics Society. Congratulations to all of them!
IES would like also to express great appreciation to the IES Fellow Nominating Committee chaired by Gerhard Hancke for their hard work!
The 6th International Summer School on Industrial Agents will be held at WMG, University of Warwick (United Kingdom) from 29 June to 3 July 2020. The theme of this year’s Summer School is Engineering of Cyber-Physical Production Systems. The event is designed to provide advanced training for postgraduate students, researchers and practitioners on engineering methods and automation technologies that will be the basis for Industry 4.0.
Internet of Things (IoT) technology provides new opportunities to build powerful industrial systems by connecting a large number of smart networked embedded devices. This article discusses some of the main architectural issues related to collecting and handling big data for analysis linked to IoT and cloud technologies in the industrial context. The aim is to provide a high-level introduction view of this topic, underpinned with examples from popular frameworks, and discuss open research questions and future directions.
This paper proposes a new multilevel converter topology which reduces the number of power switches and capacitors to generate the same or more number of output voltage levels as traditional multilevel converters. The operating principle is based on a variable multilevel dc-link voltage which is shared by all the phases of an output inverter stage.
University of Agder, Campus Kristiansand, Norway | 14-16 September 2020
Contributing authors and editors to this issue:
ITeN editorial board, Terry Martin, Lucia Lo Bello, Chandan Chakraborty, Leopoldo Franquelo, Raul Roman, Mohamed Benbouzid, Kawai Eric Cheng, Victor Huang, Shihua Li, Sheldon Williamson, Ligang Wu, Bo Cheng, Margarita Norambuena, Alfonso Damiano, Michael Ruderman, Bilal Ahmad
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