The IEEE Transactions on Industrial Cyber-Physical Systems (TICPS) publishes original papers related to a broad range associated with the industrial cyber-physical systems (ICPS) knowledge domain. Industrial Cyber-Physical Systems are the engineered systems that are built from, and depend upon, the seamless integration of computation and physical components.
Example areas of interest include but are not limited to:
- ICPS Architectures
- ICPS Technologies
- Tools for ICPS
- Engineering and Management of Systems of ICPS
- Artificial Intelligence Empowered ICPS
- Trustworthy and Reliable ICPS
- Applications of ICPS
- Education and Training for ICPS
About the new T-ICPS journal
The articles in this journal are peer reviewed in accordance with the requirements set forth in the IEEE PSPB Operations Manual (sections 8.2.1.C & 8.2.2.A). Each published article was reviewed by a minimum of two independent reviewers using a single-blind peer review process, where the identities of the reviewers are not known to the authors but the names and affiliations of the authors are known to the reviewers. Submitted articles will be screened for plagiarism before review process.
The official launch date for TICPS (the inaugural issue) is February 2023.
To check the T-ICPS Call for Paper and learn more about the IEEE Transactions on Industrial Cyber-Physical System: https://www.ieee-ies.org/pubs/transactions-on-industrial-cyberphysical-systems
To submit your manuscript: https://mc.manuscriptcentral.com/ticps.
Contact the Editor in Chief, Okyay Kaynak, at firstname.lastname@example.org for questions and additional information.